AMD STRIKES BACK WITH HBM

The relentless pursuit of enhanced performance in artificial intelligence (AI) and high-performance computing (HPC) has led to a fierce competition between industry giants.In this arena, AMD is not only participating but actively redefining the landscape.With Nvidia making waves with their new architecture, AMD has responded with an impressive strategy focused on High Bandwidth Memory (HBM) technology. Still, it must be be more cost-friendly than HBM. AMD could probably move N31 to HBM3 with a little redesign and maybe by integrating HBM logic die into the base of the MCD by working with Samsung or SK Hynix, then stacking HBM on top; problem is that HBM PHYs are relatively large at full bit width, but half-PHYs are an option too.This isn't just about more gigabytes; it's about a fundamental shift in how data is accessed and processed, unlocking unprecedented levels of computational power.The innovative use of HBM3 and HBM3E, particularly through strategic partnerships with memory leaders like Samsung and SK Hynix, positions AMD to challenge established norms and potentially leapfrog the competition in critical performance metrics.This strategic focus on HBM underscores AMD's commitment to pushing the boundaries of what's possible in data center AI, intelligent edge devices, and beyond. The high-bandwidth memory (HBM) interface provides a highly parallel data interface to DRAM memory. The HBM interface is a convergence of fast memory, adaptable compute, and secure connectivity in a single platform. The series is designed to keep up with the higher memory needs of the most compute intensive, memory-bouGet ready to witness how AMD is leveraging this memory technology to reshape the future of computing.

The Power of HBM: A Deep Dive

High Bandwidth Memory (HBM) represents a significant leap forward in memory technology, offering substantially higher bandwidth compared to traditional memory solutions like DDR5. There are some algorithms that are memory bound, limited by the 77 GB/s bandwidth available on DDR-based AMD Alveo cards. For those applications, there are high-bandwidth memory (HBM)-based Alveo cards, providing up to 460 GB/s memory bandwidth.The key difference lies in HBM's 3D stacked architecture, where multiple DRAM dies are vertically stacked and interconnected using through-silicon vias (TSVs). hbm および pcie4c を使用する設計で最適なタイミング qor を達成し、配線の密集を最小限に抑えるには、 amd では slr0 の 32 個の hbm axi インターフェイスから最遠の pcie4c サイトを使用することをお勧めします。次の図に、これらのサイト pcie4ce4_x0y1 および pcie4ce4This allows for wider data paths and significantly reduced power consumption per bit transferred, making it ideal for demanding workloads.

Why HBM Matters for Performance

For applications that are memory-bound – where performance is limited by the speed at which data can be transferred to and from memory – HBM offers a transformative solution.Consider, for example, algorithms used in AI model training and inference, scientific simulations, and large-scale data analytics.These applications often require accessing massive datasets, and traditional memory architectures can become a bottleneck. AMD could probably move N31 to HBM3 with a little redesign and maybe by integrating HBM logic die into the base of the MCD by working with Samsung or SK Hynix, then stacking HBM on top; problem is that HBM PHYs are relatively large at full bit width, but half-PHYs are an option too.HBM alleviates this bottleneck by providing significantly higher memory bandwidth.For example, certain AMD Alveo cards utilizing DDR-based memory are limited to 77 GB/s bandwidth.However, HBM-based Alveo cards offer a substantial upgrade, delivering up to 460 GB/s, a massive increase in memory throughput.This improved bandwidth translates directly into faster processing times, reduced latency, and overall performance gains.

• Increased Bandwidth: HBM's stacked architecture allows for much wider data buses, enabling far greater bandwidth compared to traditional memory.
• Reduced Power Consumption: The shorter data paths and optimized architecture of HBM lead to lower power consumption per bit transferred.
• Smaller Footprint: HBM's compact design allows for a higher memory capacity in a smaller physical space.

AMD's Strategic Alliance with Samsung for HBM3E

AMD's commitment to HBM is clearly demonstrated by its strategic partnership with Samsung.News has surfaced that Samsung Electronics has signed a substantial agreement with AMD, estimated at 4.134 trillion Won (approximately $3 billion USD), to supply cutting-edge 12-high HBM3E stacks. AMD has reportedly reached an agreement with Samsung to incorporate Samsung's advanced HBM3 memory and packaging technology into its MI300X GPUs. This collaboration is significant for AMD as it aims to strengthen its position in the AI industry and requires a reliable partner like Samsung to support its aggressive approach.This collaboration signifies AMD's intent to solidify its position in the competitive AI market and leverage Samsung's advanced memory technology and packaging expertise.

This agreement will see Samsung providing AMD with its fifth-generation HBM memory, HBM3E.This collaboration is particularly important for AMD's Instinct MI350 series AI chips, a key component of AMD's efforts to compete with Nvidia in the AI accelerator market.

The Significance of HBM3E

HBM3E represents the latest evolution in High Bandwidth Memory technology.It offers even greater bandwidth, lower latency, and improved power efficiency compared to its predecessors. 此外，Versal HBM 系列还可提供比上一代 HBM 解决方案高 1 倍的逻辑密度，从而可为不断发展的算法和协议充分提高性能。 根据 AMD 2025 年 5 月的内部分析，将单个支持封装内 HBM2E 的 Versal HBM VH1542 器件与 4 个 LPDDR 组件的 Versal Premium VP1502 器件实施方案进行了By integrating Samsung's HBM3E into its Instinct MI350 series, AMD can provide its customers with a significant performance advantage in AI training and inference workloads.Specifically, the 12-layer DRAM design implies massive storage capacity for on-chip data, decreasing the need to access slower external resources.This close memory proximity drastically improves overall efficiency and speed in AI applications.

Moreover, Samsung's proven track record as a leading memory manufacturer provides AMD with a reliable supply chain, ensuring that it can meet the growing demand for its AI accelerators.

AMD's CDNA Architecture and HBM Integration

AMD has consistently integrated HBM stacks into its AI and HPC accelerators based on its CDNA architecture. The high-bandwidth memory (HBM) interface is a device option included in the AMD stacked silicon interconnect (SSI) technology devices. The HBM DRAM memory die are from third-party vendors and are integrated into the AMD device using a silicon interposer for connections to the HBM interfaces on the AMD die.This architecture is specifically designed to take advantage of the high bandwidth and low power consumption offered by HBM.

How CDNA Utilizes HBM

The CDNA architecture, optimized for compute-intensive workloads, seamlessly integrates with HBM to provide a high-performance computing platform. Jim Keller s Journey and the Rise of Tenstorrent. Keller s career is a testament to his unparalleled expertise. At AMD, he designed the K7 architecture and Athlon processors, shaking up theHere's how:

• Direct Memory Access: The CDNA architecture provides direct memory access to HBM, minimizing latency and maximizing bandwidth utilization.
• Coherent Memory: HBM is integrated into the coherent memory space of the CDNA architecture, allowing for efficient data sharing between different processing units.
• Optimized Memory Controllers: AMD has developed specialized memory controllers that are specifically designed to optimize the performance of HBM within the CDNA architecture.

The AMD Instinct MI300X GPUs, for instance, are a prime example of this integration. Power calculation generated using AMD Power Design Manager and a third-party system power calculator. Configurations may vary, yielding different results. (VER-013) 2. Logic density vs. Virtex UltraScale HBM FPGA 3. Based on AMD internal analysis in June 2025, comparing the Versal HBM VH1782 device with GTYP and GTM transceivers, to aReports indicate that AMD has reached an agreement with Samsung to incorporate Samsung's advanced HBM3 memory and packaging technology into the MI300X GPUs.This collaboration is crucial for AMD's AI strategy, providing the necessary memory bandwidth to handle the demanding workloads associated with large language models and other AI applications.

AMD's MI325X AI Accelerator and HBM Advancements

AMD's commitment to leveraging HBM technology is further underscored by the announcement of its upcoming Instinct MI325X AI accelerator.This accelerator is expected to incorporate the latest advancements in HBM technology, delivering even greater performance and efficiency. Produktvorteile. Die Versal HBM-Serie beinhaltet eine heterogene Integration von schnellem Speicher, sicherer Konnektivit t und adaptivem Computing, um Verarbeitungs- und Speicherengp sse f r speichergebundene, rechenintensive Auslastungen, wie z. B. maschinelles Lernen, Datenbankbeschleunigung, Firewalls der n chsten Generation und erweiterte Netzwerktester, zu beseitigen.Following the announcement of the Nvidia architecture, the MI325X underscores AMD’s commitment to innovation in the GPU field.

What to Expect from the MI325X

While detailed specifications are still emerging, here's what we can anticipate from the AMD Instinct MI325X AI accelerator:

• HBM3E Integration: The MI325X is expected to utilize HBM3E memory, providing a significant boost in memory bandwidth compared to previous generations.
• Enhanced Compute Performance: The MI325X will likely feature an enhanced CDNA architecture, delivering increased compute performance for AI and HPC workloads.
• Improved Power Efficiency: AMD is continually working to improve the power efficiency of its accelerators, and the MI325X is expected to offer improvements in this area as well.

The use of HBM allows the MI325X to handle the large datasets and complex calculations involved in AI model training and inference more effectively than traditional memory solutions. Korean media reports that Samsung Electronics has signed a 4.134 trillion Won ($3 billion) agreement with AMD to supply 12-high HBM3E stacks. AMD uses HBM stacks in its AI and HPC accelerators based on its CDNA architecture.The increased memory bandwidth results in faster processing times, reduced latency, and an overall improvement in system performance.

Overcoming HBM Challenges: Cost and Design Considerations

While HBM offers significant performance advantages, it also presents certain challenges, particularly in terms of cost and design complexity.HBM is typically more expensive than traditional memory solutions, and its integration requires specialized design expertise.

Addressing the Cost Factor

To mitigate the cost of HBM, AMD is exploring various strategies, including:

• Optimizing HBM Capacity: AMD carefully considers the HBM capacity required for each application, aiming to strike a balance between performance and cost.
• Advanced Packaging Techniques: AMD is investing in advanced packaging techniques to reduce the cost of integrating HBM into its accelerators.

Simplifying the Design Process

To simplify the design process associated with HBM integration, AMD provides a comprehensive suite of tools and resources, including:

• HBM IP: AMD provides HBM IP that simplifies the integration of HBM into FPGA designs.This IP handles calibration and power-up, reducing design complexity and risk.
• Design Guides and Documentation: AMD offers detailed design guides and documentation that provide guidance on HBM integration, including best practices and troubleshooting tips.

The company is also exploring innovative design approaches, such as integrating the HBM logic die into the base of the MCD (Multi-Chip Die) and stacking HBM on top. HBM IP, made available for Virtex UltraScale HBM devices, gives access to the highest available memory bandwidth, packaged with reliable UltraScale FPGA technology. The HBM IP handles calibration and power-up. The memory is in-package, so there is no need for additional PCB complexity.This approach could potentially reduce the complexity of HBM integration and lower costs.The main challenge with this approach, though, is that HBM PHYs (physical layer interfaces) tend to be large at full bit width, yet the alternative of half-PHYs could offset some of the bandwidth advantages.

Versal HBM Series: A Case Study in HBM Implementation

The Versal HBM series exemplifies AMD's successful implementation of HBM in its adaptive computing solutions.This series combines fast memory, secure connectivity, and adaptive computing to address processing and memory bottlenecks in memory-bound, compute-intensive workloads.

Key Features of the Versal HBM Series

The Versal HBM series offers several key advantages, including:

• High Memory Bandwidth: The Versal HBM series provides high memory bandwidth through the integration of HBM stacks.
• Adaptive Computing: The Versal architecture allows for the adaptation of hardware resources to meet the specific needs of different applications.
• Secure Connectivity: The Versal HBM series provides secure connectivity options, ensuring data integrity and confidentiality.

The Versal HBM series is particularly well-suited for applications such as machine learning, database acceleration, next-generation firewalls, and advanced network testers. Following the news of the new NVidia architecture, AMD answered with its new High Bandwidth Memory (HBM) chip. AMD and NVidia have always been competing who could make a video card powerfulFor instance, comparing a Versal HBM VH1782 device with GTYP and GTM transceivers to an implementation using a Virtex UltraScale HBM FPGA with HBM stacks results in up to a 5X higher look-up rate due to HBM bandwidth, and 80X more search entries than commercially available TCAMs. amd-smi shows 1 GPU with 304 CUs and 192GB HBM. Workgroups are automatically distributed across all XCDs (round-robin). The GPU will always revert back to this default SPX mode when the system is rebooted or when the amdgpu driver is unloaded and reloaded.This showcases the significant performance gains achievable through HBM integration. Samsung's stride continued as its HBM3 offerings received AMD MI300 series certification by 1Q24, enhancing its standing as a crucial supplier to AMD. This milestone paves the way for an increase in Samsung's HBM3 production distribution starting from 1Q24.The high-bandwidth memory (HBM) interface is a device option included in the AMD stacked silicon interconnect (SSI) technology devices.

The Future of AMD and HBM

AMD's commitment to HBM is a strategic move that positions the company for continued success in the high-performance computing and AI markets. Search and filter AMD blogs to discover the latest news, product information, technical deep-dives, and insights from AMD.As memory technology continues to evolve, AMD is well-positioned to leverage the latest advancements in HBM to deliver even greater performance and efficiency.The company's partnerships with memory leaders like Samsung and SK Hynix will be crucial in ensuring a reliable supply of HBM and enabling the development of innovative new products.

What's Next for HBM?

We can expect to see the following developments in HBM technology in the coming years:

• Increased Bandwidth: Future generations of HBM will likely offer even greater bandwidth, enabling even faster processing times for demanding workloads.
• Lower Power Consumption: Ongoing research and development efforts will focus on reducing the power consumption of HBM, making it even more energy-efficient.
• Improved Integration: Advancements in packaging technology will lead to improved integration of HBM into processors and accelerators, reducing costs and simplifying design.

AMD's strategic focus on HBM is a testament to its commitment to innovation and its vision for the future of computing.By leveraging the power of HBM, AMD is empowering its customers to tackle the most challenging computational problems and unlock new possibilities in AI, HPC, and beyond.

Conclusion: AMD's HBM Strategy - A Game Changer?

AMD's calculated embrace of HBM technology is more than a simple upgrade; it's a strategic pivot aimed at dominating the future of AI and HPC.By forging strong alliances with memory giants like Samsung and SK Hynix, AMD is securing access to the cutting-edge HBM3E, ensuring its Instinct MI350 and MI325X series AI chips are armed with unparalleled memory bandwidth. According to a report from Korean media outlet viva100, Samsung has signed a new USD 3 billion agreement with processor giant AMD to supply HBM3e 12-layer DRAM for use in the Instinct MI350 series AI chips.This move directly tackles memory bottlenecks, unleashing a surge in processing power for demanding applications like AI training and large-scale simulations. Versal HBM Series Data Sheet: DC and AC Switching Characteristics (DS960) - Contains the AMD Versal HBM Series specifications for DC and AC switching characteristics. - DS960 Document ID DS960 Release Date Revision 1.5 English. Summary; DC Characteristics; Absolute Maximum Ratings; Recommended Operating ConditionsThe Versal HBM series further proves AMD's mastery in seamlessly integrating HBM into adaptable computing platforms.While challenges like cost and design complexity exist, AMD's innovative approaches and resource investments are steadily paving the way for widespread adoption.As HBM technology advances, AMD is poised to remain at the forefront, driving the next wave of innovation in high-performance computing. AMD delivers leadership high-performance and adaptive computing solutions to advance data center AI, AI PCs, intelligent edge devices, gaming, beyond.Key takeaways include AMD's strategic partnerships, focus on HBM3E, optimization for CDNA architecture, and advancements with the MI325X. End of Search Dialog. LoadingExplore AMD's blogs for the latest news and product information.Are you ready to experience the future of computing powered by AMD's HBM revolution?